Talent.com
Packaging Engineer (Power Module)

Packaging Engineer (Power Module)

Texas InstrumentsMalacca City, Malacca, Malaysia
8 days ago
Job description

Change the world. Love your job. As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry’s top engineering minds at your disposal. TI’s corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy. Put your talent to work with us as a Packaging engineer – change the world, love your job!

Responsibilities may include :

  • Optimizing and establishing robust and high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology
  • Defining simplified manufacturing process sequence for different components attach
  • Managing multiple new product executions starting from kick-off, product prototyping, characterization, learning cycles, and qualifications until product RTM including project documentation
  • Collaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements
  • Engaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs
  • Enabling TI power modules package competitiveness through adopting the industry latest greatest capabilities in the high-volume manufacturing environment

Qualifications

  • Bachelor’s degree in Mechanical Engineering, Physics, Material Science, or a related field of study
  • Minimum 8 years-experience in the semiconductor field
  • Expert level experience in mold process development for power module.
  • Package layer design expertise such as structural configuration, material selection and process flow design
  • Hands on skills in operating machines and knowledge to down-select material, process optimization and yield improvement
  • Preferred qualifications :

  • Knowledge in trim & form and package singulation are added advantage
  • Ability to engage with a geographically diverse team with a strategic vision to drive a complex technology roadmap
  • Knowledge of IC packaging End of Line (EOL) processes, including understanding of Design for Manufacturability (DFM) constraints
  • Experience in multi-process coordination and optimization (integration between SMT and back-end packaging processes)
  • Ability to establish strong and collaborative relationships with stakeholders, global design & manufacturing teams and component / material / substrate supplier to meet on-time execution
  • Broad and deep technical understanding of power module
  • System-in-Package (SiP) experience, including Exposed Inductor integration solutions is added advantage
  • Detailed understanding with experience of manufacturing process and demonstrated capability of taking new technology concepts to high yield, low cost and high-volume production
  • Familiarize on module package reliability requirement and module package defect criteria.
  • Knowledge in FMEA methodology, process control plan, statistical analysis, SPC and DOE methodology. Skilled in JMP statistical analysis software is an added advantage
  • Good at Microsoft software – power point, excel and outlook. Experience in packaging development, with expertise in leaded module package and passive component integration
  • Experience with assembly of power modules packaging, substrate design and reliability requirements
  • Hands-on experience with flip chip, chip shooter or any other component attached equipment.
  • Components are referring to resistors, capacitors, inductors, clips
  • Project management experience in semiconductor industry specifically in Assembly Test or SMT Operation
  • Key personal characters – trustworthy, inclusive, innovative, competitive, result-oriented
  • About Us

    Why TI?

  • Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
  • We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.Meet the people of TI
  • Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
  • About Texas Instruments

    Texas Instruments Incorporated (Nasdaq : TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com .

    Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.

    If you are interested in this position, please apply to this requisition.

    TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.

    Job Info

  • Job Identification
  • Job Category Engineering - Product Dev
  • Posting Date 10 / 23 / 2025, 07 : 46 AM
  • Apply Before 10 / 31 / 2025, 09 : 00 AM
  • Degree Level Bachelor's Degree
  • Locations MELA Batu Berendam Free Trade Zone, Melaka, 75350, MY
  • Texas Instruments is an equal opportunity employer. Click here to learn more and for information on accessibility and your rights as an applicant.

    #J-18808-Ljbffr

    Create a job alert for this search

    Packaging Engineer • Malacca City, Malacca, Malaysia

    Related jobs
    • Promoted
    Test Application Development (Software)

    Test Application Development (Software)

    Rohde & SchwarzKebun Baharu, Johor, Malaysia
    Test Application Development (Software).Develop software solutions for high-precision test systems for software-defined radios, develop software solutions for PCBA testing.Keep a close eye on the e...Show moreLast updated: 23 days ago
    • Promoted
    Ubuntu Security Engineer

    Ubuntu Security Engineer

    CanonicalPasir Panjang, Negeri Sembilan, Malaysia
    Canonical Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia.Join or sign in to find your next job.Canonical Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia.Be among the first 25 a...Show moreLast updated: 30+ days ago
    • Promoted
    Senior Staff Engineer Package Development

    Senior Staff Engineer Package Development

    Infineon Technologies AGMalacca City, Malacca, Malaysia
    Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification) activities for package projects with major changes / new package, risks and impact.Gener...Show moreLast updated: 30+ days ago
    • Promoted
    Senior Project Engineer

    Senior Project Engineer

    ABBKebun Baharu, Johor, Malaysia
    At ABB, we help industries outrun - leaner and cleaner.Here, progress is an expectation - for you, your team, and the world. As a global market leader, we’ll give you what you need to make it happen...Show moreLast updated: 12 days ago
    • Promoted
    Test Application Development (Software & Hardware)

    Test Application Development (Software & Hardware)

    Rohde & SchwarzKebun Baharu, Johor, Malaysia
    Test Application Development (Software & Hardware).We are looking for a dynamic, self-driven and motivated Test Application Development Engineer with experience in test technologies of analog / RF / Di...Show moreLast updated: 23 days ago
    • Promoted
    Senior Process Engineer(Die Attach)

    Senior Process Engineer(Die Attach)

    NexperiaSeremban, Negeri Sembilan, Malaysia
    Senior Process Engineer (Die Attach).This role requires a strong technical background, hands-on process expertise, and the ability to lead cross-functional discussions to ensure robust manufacturab...Show moreLast updated: 12 days ago
    • Promoted
    Reliability Engineer

    Reliability Engineer

    NexperiaSeremban, Negeri Sembilan, Malaysia
    Reliability Engineer page is loaded## Reliability Engineerlocations : Serembanposted on : Posted Todayjob requisition id : R- Nexperia is a world-class company in semiconductor development and i...Show moreLast updated: 2 days ago
    • Promoted
    Director Group Digital Workplace

    Director Group Digital Workplace

    DKSHPasir Panjang, Negeri Sembilan, Malaysia
    Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia.DKSH Digital & IT is dedicated to supporting a wide range of state-of-the-art system solutions that connect thousands of people around the ...Show moreLast updated: 30+ days ago
    • Promoted
    Senior / Staff / Principal Engineer

    Senior / Staff / Principal Engineer

    CanonicalMuar, Johor, Malaysia
    Canonical Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia.Join or sign in to find your next job.Senior / Staff / Principal Engineer. Canonical Kuala Lumpur, Federal Territory of Kuala Lumpur, ...Show moreLast updated: 30+ days ago
    • Promoted
    Senior Software Engineer - Digital Workplace

    Senior Software Engineer - Digital Workplace

    CanonicalPasir Panjang, Negeri Sembilan, Malaysia
    Senior Software Engineer - Digital Workplace.Canonical Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia.Canonical is a leading provider of open source software and operating systems to the...Show moreLast updated: 30+ days ago
    • Promoted
    Site Reliability / Gitops Engineer

    Site Reliability / Gitops Engineer

    CanonicalMalacca City, Malacca, Malaysia
    Canonical is a leading provider of open source software and operating systems to the global enterprise and technology markets. Our platform, Ubuntu, is widely used in breakthrough enterprise initiat...Show moreLast updated: 30+ days ago
    • Promoted
    Lead Engineer

    Lead Engineer

    Soft Space Sdn BhdPasir Panjang, Negeri Sembilan, Malaysia
    We are seeking a technically strong leader based in Malaysia to head our North America region projects.The Lead Engineer will take ownership of regional delivery, technical solutioning, and team le...Show moreLast updated: 2 days ago
    • Promoted
    Site Reliability Engineer - Based in Johor Bahru

    Site Reliability Engineer - Based in Johor Bahru

    Arvion ServicesKebun Baharu, Johor, Malaysia
    Site Reliability Engineer – Johor Bahru.Site Reliability Engineer – Johor Bahru.As a Site Reliability Engineer (SRE), you will play a key role in maintaining the reliability and performance of crit...Show moreLast updated: 12 days ago
    • Promoted
    Software Engineer, Android Core Product - Kuala Lumpur, Malaysia

    Software Engineer, Android Core Product - Kuala Lumpur, Malaysia

    SpeechifyPasir Panjang, Negeri Sembilan, Malaysia
    The mission of Speechify is to make sure that reading is never a barrier to learning.Over 30 million people use Speechify’s text-to-speech products to turn whatever they’re reading – PDFs, books, G...Show moreLast updated: 30+ days ago
    • Promoted
    Utilities Engineer

    Utilities Engineer

    LonzaKampung Ayer Keroh, Melaka, Malaysia
    Today, Lonza is a global leader in life sciences operating across five continents.While we work in science, there’s no magic formula to how we do it. Our greatest scientific solution is dedicated in...Show moreLast updated: 4 days ago
    • Promoted
    Senior Engineer (Wirebond Process Development)

    Senior Engineer (Wirebond Process Development)

    NexperiaSeremban, Negeri Sembilan, Malaysia
    A proven global player with an entrepreneurial mentality.At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goal...Show moreLast updated: 30+ days ago
    • Promoted
    Senior Sales Engineer

    Senior Sales Engineer

    Wentel Engineering Sdn BhdKebun Baharu, Johor, Malaysia
    Be among the first 25 applicants.Direct message the job poster from Wentel Engineering Sdn Bhd.Senior HR Executive at Wentel Engineering Sdn Bhd. Responsible for new enquiry costing and quotation.Co...Show moreLast updated: 2 days ago
    • Promoted
    Senior Engineer, Wafer Back Grind

    Senior Engineer, Wafer Back Grind

    NexperiaSeremban, Negeri Sembilan, Malaysia
    Responsible for the development, optimization, and sustaining of wafer back grinding processes for semiconductor devices. The engineer will lead technology development projects, work with cross-func...Show moreLast updated: 30+ days ago