Technology Development Engineer (Solder Resist/Solder Mask, Lamination, Gold/Electroless Plating)Austria Technologie & Systemtechnik AG • Kulim, Kedah, Malaysia
Technology Development Engineer (Solder Resist / Solder Mask, Lamination, Gold / Electroless Plating)
Austria Technologie & Systemtechnik AG • Kulim, Kedah, Malaysia
23 hari lalu
Penerangan pekerjaanCommunicate directly to Customer Authority to give instructions and guidance to technical subordinates Guide Engineers in their work, help them to grow in their job and responsibility Project management / leading Plan out your processes and provide support to the other departments involved. Basic SRSF tasks as a SRSF TD engineer(Responsible to Lead process, Block process / lot / machine if needed and YIP, Review / TRA / Optimize for NPI products, Manage / Contribute Task force, Do system management(QMS documents, Audit, etc) New material development & qualification in back-end(SRSF, Assembly and Test department) based on customer projects Assist Program Management tasks and programs as assigned by Program Management Manager. Coordinate feasibility studies of new projects / programs(Liaise with various stakeholders to study the feasibility of participating on new projects / programs Any tasks which are assigned / given by Manager Bachelor of Engineering (Science, Chemistry, Mechanical, Material, etc) More than 2 years of experience in / as PCB / ICS / Assembly or more than 7years in / as Semiconductor industry Subject matter expert in key process(es) for PCB / Substrate manufacturing Strong oral and written communication skills. Ability to manage and develop cross-functional technical teams. Familiarity with Design of Experiments, Quality by Design, Commonality Analysis and Quality Risk Management concepts commonly employed in high volume manufacturing industries. Strong understanding of project management systems and tools is preferred. Excellent organizational skills and the ability to successfully manage a multitude of technical projects. Ability to work in a fast paced, complex and changing environment. Excellent analytical, technical and strategic thinking skills and experiences. Flexible and willingness to travel for work-related assignments Open-minded and a team player Adaptable and sensitivity to multi-racial work environment Knowledge of quality tools like SPC, MSA, DOE, FMEA, CP, etc Good analytical skills with attention to details. Good stress management skills Knowledge of project management, data evaluation and design of experiments Fluent written and oral English (Mandarin would be of advantage) Good team working spirit and leadership skills Good communication and negotiation skills Good cooperation and networking with various stakeholders
Technology Development Engineer (SRSF - Solder Resistance Surface Finishing)
To enhance our successful Technology (TDI) Team in AT&S Malaysia in Kulim Hi-Tech Park, Kedah , we are looking for a passionate
Your Responsibilities
- SRSF TD engineering tasks as a SRSF engineer
SRSF Scope : SR Lamination, SR Exposure, SR Development and ENEPIG(including Plasma & Etching)
Including New material qualification for Back-end such as new SR, micro ball, etc depends on requirement situation
Your Profile
Our Offer
Personal and professional growth opportunities in a Greenfield Project of a recognized MNC
A chance to actively contribute to AT&S´ success and to create value
A secure position with long-term career perspective in an internationally expanding environment
Attractive and competitive compensation package
Ready for a new challenge to advance your career? It´s just a click to apply online. We look forward to your application and your detailed resume. Your AT&S Team!
AT&S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths. Our compensation packages are competitive and take individual qualifications and experience into consideration.
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