The Packaging Resident Staff Engineer will perform technical oversight and audit, document, implement, monitor and improve processes related to pSemi products that are manufactured or processed at Unisem or UAT factories located in Ipoh or Gopeng, Malaysia.
This position will be responsible for, but not limited to, the following functions :
- NPI package development and assembly support (including wafer bumping)
- Package manufacturing technical oversight
- Facility technical and quality auditing
- Supplier corrective action management (technical)
- Day-to-day problem resolution (e.g. quality holds) at suppliers.
This role will work with pSemi engineers to transfer and align processes for consistent manufacturing, coordinate with NPI Packaging and Sustaining Engineering to establish and oversee new bumped die or plastic package assembly.They will also work together to ensure consistency in processing quality.The engineer will be responsible for the dispositioning of any discrepant material. He or she will specify, implement and monitor process control procedures, focus on improving production efficiencies / capacity, production yields and support the company objectives.This role will use proven problem-solving methodologies to provide technical support for quality processing and to meet production demands. This position establishes and implements operator processing specifications and improves manufacturing techniques, and production yields.
Roles & Responsibilities will include :
This position has responsibility for :
Providing engineering support and coordinating package development with new product development teams and operationsAnalyzing, developing, and qualifying robust manufacturing processes for the improvement of yield, cost, quality, cycle time and capacityDirecting and overseeing process characterization and development for pSemi productsDeveloping and implementing process control techniques and procedures into manufacturing environmentsDeveloping, reporting and improving metrics for processes under your responsibilityEnsuring monitoring and maintenance of process and process controlsOverseeing failure analysis and problem resolution in the development process or production environment and providing engineering support to trouble shoot and resolve technical problemsOverseeing the disposition of production discrepant materialMeasuring, analyzing and reporting incoming quality issues to the subcontractors, especially for product that comes from the San Diego facilityCreating and maintaining related manufacturing process and quality documentsCoordinating Process Change Notice (PCN) activitiesConducting process optimization, FMEA, process flow diagrams, control plans and work instructionsMinimum Qualifications (Experience & Skills)
Typically requires 8 years of experience in related fieldKnowledge of back-end semiconductor manufacturing processes and conceptsUnderstanding the chip design and manufacturing process and interaction with packaging and assembly.Experience with package assembly process developmentCross-functional team leadershipExperience in conducting Technical or Quality AuditExcellent Project management skills and the ability to prioritize multiple projectsExperience in 8-D problem solving methodology including Root Cause Analysis toolsProficiency in process characterization and Design of ExperimentsExcellent knowledge of statistical process control (SPC) including process capability studiesExtensive proficiency creating written and pictorial documentation of manufacturing processesAbility to train manufacturing processes to production personnelUnderstanding of the semiconductor supply chainUnderstanding materials properties and interactionsUnderstanding of RF packaging requirementsMastery of Word, Excel, and PowerPointExperience driving packaging development effortsRead, interpret and comprehend complex written technical documents / publicationsPreferred Qualifications
Communicate clearly using written and verbal skillsWell organized with meticulous attention to detailMaintain flexibility and adaptability to changing priorities and assignments, coping with rapidly changing informationWork well under pressure while managing competing demands and tight deadlinesRemain engaged, proactive and positive in tough circumstances, owning the processes are under your responsibleEducation Requirements :
Bachelor’s Degree in an engineering or related disciplineWork Environment
This job operates in a semiconductor manufacturing environment. This role routinely uses standard office equipment.
Physical Demands
The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. While performing the duties of this job, the employee is regularly required to talk or hear. The employee frequently is required to stand; walk; use hands to finger, handle or feel; and reach with hands and arms. Specific vision abilities required by this job include close vision, distance vision, color vision, peripheral vision, depth perception and ability to adjust focus. This position requires the ability to occasionally lift office products and supplies, up to 20 pounds.
