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NPI Process Development Engineer

NPI Process Development Engineer

NXP SemiconductorsKuala Lumpur, Kuala Lumpur, Malaysia
30+ days ago
Job description

Responsibilities

  • Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.
  • Responsible for quality, yield, cost and process improvement activities.
  • Responsible for process documentation, process spec, standard work instruction, OCAP, QIT etc.
  • Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization / company / customer.
  • Take ownership to work closely with upper management to align scope and direction of key projects.

Qualifications

  • Bachelor in Engineering, knowledge and work experience with semiconductor assembly background for automotive customers. Fresh graduates are encouraged to apply.
  • Experience in LQFP, MAPBGA, SiP, FCCSP, FCBGA etc. packing development will be an added advantage.
  • Good technical knowledge and hands-on experience in process characterization for key processes such as laser dicing, plasma dicing, mechanical saw, die bond, wire bonding, mold, ball attach, marking, singulation etc.
  • Candidate must have great interpersonal skills, leadership skills, result orientated, self-driven and eager to strive for success.
  • Good SPC, Process Control and other relevant statistical & problem-solving skills.
  • Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project Management knowledge is an added advantage.
  • Seniority level

  • Mid-Senior level
  • Employment type

  • Full-time
  • Job function

  • Engineering and Information Technology
  • Industries

  • Semiconductor Manufacturing
  • Computers and Electronics Manufacturing
  • Software Development
  • Referrals increase your chances of interviewing at NXP Semiconductors by 2x

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    Npi Engineer • Kuala Lumpur, Kuala Lumpur, Malaysia