Company Background
Our client is a rapidly growing cloud IT infrastructure provider, specializing in computing, storage products, and rack solutions for leading data centers. Led by a highly experienced team from the ODM, server, and storage sectors, the company combines deep technical expertise with the agility of a startup. With global partnerships and an end-to-end cloud-enabling service approach originating from Taiwan, our client is well-positioned for continued growth and expansion.
Job Responsibility :
- Oversee planning, installation, and integration of new machinery into production lines with minimal disruption.
- Lead resolution of engineering challenges during NPI and early production runs, ensuring smooth ramp-up.
- Manage product testing, validation protocols, and engineering change processes (firmware, documentation, control systems).
- Drive root cause investigations, CAPA, and continuous improvement initiatives to enhance yield, quality, and efficiency.
- Develop and maintain DFX, PFMEA, and test tool readiness for mass production.
- Collaborate with FAEs, vendors, and cross-functional teams to resolve field issues and improve customer satisfaction.
- Provide strategic direction on engineering projects while promoting safety, quality, and compliance culture.
Job Requirements :
14 - 16 years experience in engineering, preferably in PCBA / SMT manufacturing or server products.Strong background in electronic functional testing, troubleshooting, and process optimization.Bachelors degree in Engineering (Electronics, Electrical, Computer, or related field); Masters degree is a plus.Proven ability to lead cross-functional teams and support NPI and continuous improvement.Hands-on experience in ECN management, test coverage planning, and production readiness.Knowledge of SMT, PCBA, and server manufacturing standards.Excellent communication, analytical, and leadership skills.Location : Senai, Johor
Salary Range : RM 12,000 - 16,000