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Chipbond Technology Corporation
Manufacturing, Transport & Logistics 101-1,000 employees
Chipbond Technology was founded in July 1997, as a downstream packaging and testing service provider in the semiconductor industry, headquarters in Taiwan, Hsinchu Science Park.
We have expanded the operations to 6 locations with approximately 5,200 people.
We are one of the few companies in the country that possesses a competitive advantage in the entire process of manufacturing, packaging and testing of driver ICs.
Additionally, we are the world's largest packaging and testing facility for display driver ICs and hold a prominent position among the top ten semiconductor packaging and testing companies globally.
We are expanding our footprint to Penang, Malaysia. Let's join us as Pioneer Team!
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