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IC Package Design Engineer (Flip Chip / Substrate)

IC Package Design Engineer (Flip Chip / Substrate)

USTBayan Lepas, Penang, Malaysia
10 days ago
Job description

We are hiring Engineers! | Talent Acquisition @ UST

Role Overview

We are seeking a highly skilled Package Design Engineer with 5–8 years of experience in advanced IC packaging. The ideal candidate will have strong expertise in Flip Chip and multi-layer substrate (8+ layers) design , with a solid understanding of substrate manufacturing and assembly rules. The role requires close collaboration with cross-functional teams and vendors to deliver high-performance, reliable, and manufacturable package solutions.

Key Responsibilities

  • Perform the design and development of multi-layer package substrates (8+ layers) for advanced semiconductor devices.
  • Perform package layout, routing, and stack-up planning using EDA tools (Mentor Graphics, Cadence Allegro, PLA) .
  • Ensure designs comply with substrate manufacturing rules (trace width / spacing, via design, impedance requirements).
  • Incorporate assembly rules (die placement, bump / ball pitch, solder joint reliability, warpage control) into package designs.
  • Develop and validate Flip Chip package designs , including bump assignment, redistribution layers (RDL), and underfill considerations.
  • Collaborate with Signal Integrity (SI), Power Integrity (PI), and thermal analysis teams to ensure robust performance.
  • Partner with substrate vendors and OSATs to verify design manufacturability, yield, and assembly feasibility.
  • Provide on-site vendor support when required to resolve design and assembly issues.

Skills & Qualifications

  • Bachelor’s or Master’s degree in Electrical Engineering, Electronics, Materials Science, or related field .
  • 5–8 years of hands-on experience in package design, with proven expertise in multi-layer (8+) substrate design .
  • Proficiency with EDA tools : Mentor Graphics, Cadence Allegro, PLA. (Mentor Graphics Xpedition / Cadence Allegro Package Designer)
  • Strong knowledge of substrate manufacturing rules and assembly rules .
  • Experience with Flip Chip package design methodologies .
  • Familiarity with SI / PI / thermal considerations in advanced packages.
  • Strong communication and collaboration skills for cross-functional and vendor engagement.
  • Flexibility to travel and provide on-site vendor support as needed.

    • Seniority level : Mid-Senior level

    Employment type : Full-time

    Job function : IT Services and IT Consulting

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    Design Engineer • Bayan Lepas, Penang, Malaysia