Die Bond / Wire Bond Process Development Senior Staff Engineer

Responsibilities

Develop or optimize Die Bond and Wire Bond processes for new product development project to meet project cost, quality and timeline targets.

Participate and support FOL processes technology roadmap and building block activities.

Equipment selection which meet project cost, quality and timeline target.

Share and transfer technical know how within R&D and to Manufacturing team.

Provide technical guidance or job coaching to junior supporting staff.

Participate in engineering sample, pre-series and ramp-up build to fulfill customer order.

Qualifications

Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.

• 5+ years of experience in semiconductor field
• 5+ years of experience in Die Bond and Wire Bond processes
• Process engineering knowledge in semiconductors or LED manufacturing processes
• Knowledge in process development step and statistic
• B. Minitab knowledge will be advantage
• Six Sigma Green or Black Belt will be advantage

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