Perform design and drafting drawing and specification for package and lead frame based on design guideline, assembly rules and ensure design for manufacturing, quality and cost.
Job Description
In your new role you will :
- Use of AutoCAD and Inventor tool in package development cycle. Understanding design systematics, creating 3D models and parametric control.
- Use of CAD Desktop and SAP in Inventor use case, understanding the interactions between Inventor and SAP through CAD Desktop as well as Metadata, revisioning, file linkages, and derivations.
- Design method and design flow of new package and leadframe based on technical capabilities of materials, processes and suppliers.
- Modified 2D and 3D output.
- Drive Package / leadframe 3D design development activities and ensure fulfilment of project milestone deliverables and documentation release (spec, drawing, SAP)
- Liaise with leadframe engineer to ensure fulfilment of all leadframe specification and requirement.
Your Profile
You are best equipped for this task if you have :
Basic semiconductor packaging, assembly and test.Material development, analysis, qualification and reliability.Analytical and problem solving skills.Strong mathematic knowledge (Algebra, trigonometry & etc) for Inventor parametric.GD&T knowledge / material specification definition.Drafting / designing (2D / 3D) semiconductor package (Mold Body, Wire, Chip, Solder & etc) using AutoCAD / Inventor.We are committed to diversity and inclusion and welcome everyone for who they are. Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. We offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities.
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