Owner of Reliability Functions for Package Development Projects.
Your Role
Key responsibilities in your new role
- First-Level Reliability : Good understanding of first-level reliability test objectives, requirements, and parameters; proficient in international specifications (JEDEC, AEC, IPC).
- Package Integrity Tests : Proficient in implementing major reliability tests according to project scope and requirements, based on project Delta Analysis, FMEA, and other relevant methods.
- Internal Package Analysis : Basic knowledge of FA analysis tools and methods, with the ability to apply them to completed reliability stress test samples; capable of preparing comprehensive reports and providing RQ expertise for proposals and recommendations.
- Second-Level Reliability : Basic understanding, implementation, and coordination of second-level reliability tests within RQ.
- Chip / Package / Board Co-Design (CPiB) : Proficient in CPiB and its implementation for robust packaging reliability execution and qualification through to product release.
Your Profile
Qualifications And Skills To Help You Succeed
Master’s or Bachelor’s degree in Engineering (Electrical, Electronics, Microelectronics, Mechatronics, or Semiconductor Technology) or Science (Chemistry, Physics, or Materials).Minimum 3–5 years of relevant working experience in the field or industry.Strong analytical and problem-solving skills, engineering analysis expertise, and experience in reliability assessment and stress requirements.Able to analyze and conclude root causes from failure mechanisms, have knowledge of assembly and interconnect technology of electronic devices, and contribute to FMEA based on experience with customer complaints and yield analysis.This position is open only to candidates with semiconductor manufacturing experience.
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