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Process Engineer (Advanced Packaging- Fan Out)
TF-AMD PenangPenangMalaysia, Penang, Malaysia30+ days ago
Job descriptionPhotolithography; or Sputtering / Electroplating / Etching; or Yield / SPC improvement; or Grinding / Dicing; or FCBGA / COW Bachelor\'s degree in Science and Engineering related majors More than 3 year of experience in related key areas modules and wafer level processes Good communication in English and proficiency in MS office. Basic knowledge of FMEA and DOE. Understand SPC principles and possess the ability to perform relevant analyses. Master quality management knowledge and common analysis tools, including SPC, 8D, and DOE. Familiar with MSA. Acquire expertise in the process and workflow of relevant operations, understanding process requirements, product quality benchmarks, and the materials in use. Be well-versed in the performance, operation, and debugging methods of equipment. Understand electrostatic discharge precautions and requirements. Strong self-disciplined and teamwork skills. Able to work in Batu Kawan site
Responsibilities
- Do well in the process technology and maintenance of equipment and materials.
- Responsible for liaising with other teams to improve and implement their needs within the department.
- Process parameter debug and optimization
- Responsible for the work specification definition of production line OP and update the SOP
- Responsible for yield and SPC improvement
- Responsible for the optimization and maintenance of FMEA / OCPA / SPEC
- Evaluation of new materials and machines
- Identification and definition of product defects
Key Areas Involved
Requirements
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Engineer Packaging • PenangMalaysia, Penang, Malaysia