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Process Engineer (Advanced Packaging- Fan Out)

Process Engineer (Advanced Packaging- Fan Out)

TF-AMD PenangPenangMalaysia, Penang, Malaysia
30+ days ago
Job description

Responsibilities

  • Do well in the process technology and maintenance of equipment and materials.
  • Responsible for liaising with other teams to improve and implement their needs within the department.
  • Process parameter debug and optimization
  • Responsible for the work specification definition of production line OP and update the SOP
  • Responsible for yield and SPC improvement
  • Responsible for the optimization and maintenance of FMEA / OCPA / SPEC
  • Evaluation of new materials and machines
  • Identification and definition of product defects

Key Areas Involved

  • Photolithography; or
  • Sputtering / Electroplating / Etching; or
  • Yield / SPC improvement; or
  • Grinding / Dicing; or
  • FCBGA / COW
  • Requirements

  • Bachelor\'s degree in Science and Engineering related majors
  • More than 3 year of experience in related key areas modules and wafer level processes
  • Good communication in English and proficiency in MS office.
  • Basic knowledge of FMEA and DOE.
  • Understand SPC principles and possess the ability to perform relevant analyses.
  • Master quality management knowledge and common analysis tools, including SPC, 8D, and DOE.
  • Familiar with MSA.
  • Acquire expertise in the process and workflow of relevant operations, understanding process requirements, product quality benchmarks, and the materials in use.
  • Be well-versed in the performance, operation, and debugging methods of equipment.
  • Understand electrostatic discharge precautions and requirements.
  • Strong self-disciplined and teamwork skills.
  • Able to work in Batu Kawan site
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