[2025 Fresh Graduates] Wire Bond Process Engineer (Kuala Lumpur, Malaysia)

Change the world. Love your job. Texas Instruments is looking for an energetic engineer with a passion for process. This position provides the opportunity to drive continual improvement at all levels. Our team is primarily focused on driving improved procedures and processes. We are searching for a self-directed, highly motivated WireBond Process Engineer to join our team.

Responsibilities include :

• Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies
• Identify systematic problems in either process or equipment related sources and communicating findings to the engineering staff in a continuous manner
• Support the manufacturing ramp with execution of equipment / process startup, process experiments (SWRs)
• Participate in data analysis and problem resolution
• Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality.
• Support wire bond processes for customer deliverable materials
• Document wire bond process details in specification(s) and work instructions
• Define applicable wire bond materials for specific applications (wire type, capillary part numbers, etc.)
• Define statistical monitoring methods supporting developed wire bond processes
• Implement project or improvement plans for areas of responsibility including but not limited to : efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvements

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