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Lead Principal Engineer Package Technology
Infineon TechnologiesMelaka, Malaysia7 hari lalu
Penerangan pekerjaanBachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics). 10 years of relevant working experience in IC / semiconductor environment. Semiconductor Packaging, Assembly and Test. Process and Equipment Engineering knowledge. Failure Analysis and Reliability Engineering. Analytical and Problem Solving Skills. Wide range of training offers & planning of career development International assignments Different career paths : Project Management, Technical Ladder, Management & Individual Contributor Exempt working hours are flexible within core hours (9am-12pm & 2pm- Home office options for certain tasks or due to personal circumstances. Applicable to exempt employees working on office hours only Part-time work possible for exempt employees only Exempt staff could apply up to 3-month sabbatical leave, subject to business situation Medical coverage In-house clinic operates 24 hours, doctor consultation possible from 9am to 5pm Health promotion programs Social Recreation Center with facilities, such as gym room, squash, badminton and netball court, zumba and yoga classes, etc. On-site Cafeteria Paid sick leave according to law Additional 3% to Employee Provident Fund after 10 years service with Infineon Malacca Re-employment opportunities Productivity incentive bonus Bus service for shift employees Allocated carpark for disabled and pregnant employees
Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc) activities for package projects with major changes / new package, risks and impact. Job Description
In your new role you will :
- Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed.
- Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements.
- Coordinate the package Cost Estimation (A1-A3) and Cost Indication (A3).
- Contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how.
- Support pre development & project definition stage, and continue to be package design expert throughout project phase.
- Actively scout for new packaging technologies and keep in touch with package development at competitors / subcons.
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Principal Engineer • Melaka, Malaysia