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Intern, Wire Bond Assembly Engineering

Renesas ElectronicsTelok Panglima Garang

20 hari lalu

Penerangan pekerjaan

Job Description

Work on OEE Improvement project for Wire bond process. Support Equipment engineer in MC Performance / Qualification, Work / Time Study, Capacity analysis & planning, Layout planning & execution
Gain technical knowledge on the identified tool and work with engineers, operators, and technicians.
Process Optimization : Support Process engineer in performing DOE, Wire bond Validation, Wire bond Assessment, Data Collection, Analysis and Report Compilation.

Qualifications

Education Background : Final year of a Degree in Engineering - Mechanical / Electrical / Electronics / Mechatronics / Semiconductor Technology or equivalent.

Technical Skills : Proficient in Microsoft Excel and PowerPoint. Data analytics and reporting.

Buat amaran kerja untuk carian ini

Intern • Telok Panglima Garang