Process Engineer : Wire Bond

MACOM is an Equal Opportunity Employer

We consider applicants for all positions without regard to race, color, religion, creed, gender, national origin, age, disability, marital status or veteran status or any other legally protected status.

Position Overview : We are seeking a skilled and detail-oriented Wire Bond Engineer with a strong background in wedge bonding, specifically using Hesse wire bonders. The ideal candidate will play a critical role in working with one of out Key semiconductor backend assembly contractors, ensuring optimal performance and Yield of our wire bonding processes. The role will be split across both MACOM and Contractor sites in Ipoh Perak with and expectation that at least 50% of the time will be spent on the production floor. Experience with ball bonding and additional wire bonding equipment is highly desirable. Key Responsibilities :

• Over site of the operation and optomization of Hesse wedge bonding equipment for high-yield, high-efficiency gold wire bonding production.
• Aid process troubleshooting, and root cause analysis for bonding defects or yield issues.
• Collaborate with design, process, and quality teams to evaluate wire bond integrity and develop improvements.
• Train operators / technicians on proper machine usage, bonding techniques, and safety protocols.
• Ensure contractor has suitable maintenance schedules and executes preventive maintenance accordingly.
• Work with vendors for advanced equipment and tooling support.
• Contribute to resolving quality and manufacturing issues.
• Assist in evaluating and integrating other wire bonding technologies including ball bonding, cupper wire bonding.
• Support engineering builds, new product introduction (NPI), and continuous improvement initiatives.
• Work with the contractor on RESO process improvements.  Qualifications :
• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field (or equivalent experience).
• 3+ years of experience with gold wire wedge bonding, with strong hands-on knowledge of Hesse wire bonders.
• Familiarity with ball bonding processes and equipment is a plus.
• Knowledge of wire types (gold, aluminum, copper), bond parameters, and bonding to different substrates (copper, ceramic, PCB).
• Experience in cleanroom or microelectronics packaging environments is preferred.
• Strong analytical and problem-solving skills, with the ability to interpret bond pull / shear data.
• Skilled in data analysis and visualization : Minitab, Jump, Power BI, MS suite.
• Excellent English communication skills both written and verbally.
• Ability to work in a team-oriented, fast-paced production environment.
• Skilled in data analysis and visualization : Minitab, Jump, Power BI, MS suite.  Preferred Experience :
• IPC for Wire bond MIL-STD-883 bonding practices, or related quality standards.
• Familiarity with SEM / visual inspection & FA processes for bond quality assessment.
• Experience bonding inspection tools.
• Experience with GaN power devices and Loop height optomization for resonance testing.