Penerangan pekerjaanProvide hands-on failure analysis (FA) specific on Material Analysis (MA) for support to manufacturing Yield and engineering development teams, with a focus on MODULES PACKAGE especially B2S / B6S packages on Cross section analysis, SEM-EDX and Chemical decapsulation process.Operate, maintain, and perform calibrations on FESEM / SEM systems and other FA equipment to ensure optimal performance and reliability while handling MODULES PACKAGE especially B2S / B6S packages.Consolidate analysis results and contribute to the preparation of technical or FA reports, including background, analysis, findings, and potential root cause recommendations especially related to MODULES PACKAGE (B2S / B6S packages).Maintain high standards of organization and cleanliness in the Failure Analysis Lab by upholding 6S principles.Support continuous improvement initiatives related to quality, productivity, and cost efficiency within the FA Lab especially related to MODULES PACKAGE (B2S / B6S packages).Provide comprehensive and timely material analysis, constructional analysis and technical services for internal and external customer using material analysis analytical tools.Continuously upgrade the product analysis capabilities.Generate Failure analysis report on the failure mechanism based on the analysis processes.Communicate with Lab team members and other teams (design, Product engineering, manufacturing, application and etc) related to the product analysis while determining the failure mechanismParticipate in any process development in the labDiploma in Electronics Engineering or other relevant engineering field.Experience in material analysis process is highly recommended / preferred.