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Staff Engineer (IC Packaging)

Staff Engineer (IC Packaging)

Renesas ElectronicsBayan Lepas
19 hari lalu
Penerangan pekerjaan

Job Description

  • Designing of BGA substrates and plastic lead frames packages.
  • Electrical and thermal simulation for IC packaging.
  • Provide new generation product package structure and configuration optimization.
  • Interface and coordinate with multi-functional groups on new design feasibility study, risk assessment and cost optimization.
  • Conduct thermal simulation for new devices / packages as well as to conduct electrical simulation for new devices / packages.
  • Propose design modifications or enhancements to improve thermal / electrical performance and reliability.
  • Manage collaboration and supporting technology strategy based on vendors and assembly houses current and future technology roadmap for future leading-edge packages and packaging solutions.

Qualifications

  • PhD / Masters / Bachelor Degree in Mechanical, Material Engineering, Physics, Chemistry or Applied Sciences
  • Must have strong expertise in Cadence APD and Autocad
  • Advantageous to have Q3D, SiWave, HFSS and Flotherm
  • Buat amaran kerja untuk carian ini

    Staff Engineer • Bayan Lepas