Staff Engineer (IC Packaging)

Job Description

• Designing of BGA substrates and plastic lead frames packages.
• Electrical and thermal simulation for IC packaging.
• Provide new generation product package structure and configuration optimization.
• Interface and coordinate with multi-functional groups on new design feasibility study, risk assessment and cost optimization.
• Conduct thermal simulation for new devices / packages as well as to conduct electrical simulation for new devices / packages.
• Propose design modifications or enhancements to improve thermal / electrical performance and reliability.
• Manage collaboration and supporting technology strategy based on vendors and assembly houses current and future technology roadmap for future leading-edge packages and packaging solutions.

Qualifications