Designing of BGA substrates and plastic lead frames packages.
Electrical and thermal simulation for IC packaging.
Provide new generation product package structure and configuration optimization.
Interface and coordinate with multi-functional groups on new design feasibility study, risk assessment and cost optimization.
Conduct thermal simulation for new devices / packages as well as to conduct electrical simulation for new devices / packages.
Propose design modifications or enhancements to improve thermal / electrical performance and reliability.
Manage collaboration and supporting technology strategy based on vendors and assembly houses current and future technology roadmap for future leading-edge packages and packaging solutions.
Qualifications
PhD / Masters / Bachelor Degree in Mechanical, Material Engineering, Physics, Chemistry or Applied Sciences
Must have strong expertise in Cadence APD and Autocad
Advantageous to have Q3D, SiWave, HFSS and Flotherm