MGR SR, PROCESS ENGINEERING

We are seeking a highly skilled and experienced Process Manager with expertise in die bond, wirebond, Front of Line processes in the semiconductor industry. The ideal candidate will have a strong background in managing and optimizing processes.

• Lead a group of Assembly process and process engineering driving for operation KPI such as Quality, Cost, Yield, Productivity, Equipment OEE.
• Partnering with Manufacturing to drive for Output, OTD, LOH, and Cycle time.
• Need to lead and guide the engineers for continuously improving the operation KPI using DMAIC.
• Develop and implement process improvements for Front of Line especially for die bond, wirebond process to increase efficiency and yield.
• Manage and oversee the day-to-day operations of the production lines, including Front of Line and End of Line processes.
• Collaborate with cross-functional teams to troubleshoot and resolve any issues related to semiconductor manufacturing processes.
• Ensure compliance with industry standards and regulations for all stages of semiconductor manufacturing.
• Train and mentor team members on best practices for Front of Line, End of Line, die bond, and wirebond processes.
• Monitor and analyze key performance indicators to track the success of semiconductor manufacturing processes.
• Degree in Engineering.
• Minimum of 5 years of experience in die bond, wirebond, Front of Line process in the semiconductor industry.
• Proven track record of successfully managing and optimizing semiconductor manufacturing processes .
• Strong analytical and problem-solving skills .
• Excellent communication and leadership abilities .
• Ability to work effectively in a fast-paced and dynamic environment