Production Section Head (Wafer Sawing and Backgrind)

Production Section Head (Wafer Sawing and Backgrind)

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The Production Engineer responsible for monitoring and improving production processes, particularly in the areas of backgrinding and wafer sawing, to ensure optimal yield, efficiency, and quality. This role supports production operations through process optimization, troubleshooting, and continuous improvement, ensuring smooth coordination with other departments such as quality, equipment, and planning.

Key Responsibilities :

• Supervise and optimize daily operations for wafer backgrind and sawing processes.
• Train operators and technicians on best practices, safety procedures, and quality standards.
• Monitor key process parameters and yields; take corrective actions when deviations occur.
• Lead or participate in yield improvement, cost reduction, and productivity enhancement projects.
• Develop, update, and implement Standard Operating Procedures (SOPs) for backgrind and sawing processes.
• Analyze production data to identify trends, root causes of issues, and drive process improvements.
• Work closely with maintenance and equipment teams to ensure high equipment uptime and preventive maintenance effectiveness.
• Collaborate with R&D and quality teams to support new product introduction and ensure process readiness.
• Conduct regular audits and ensure compliance with EHS and quality standards.
• Maintain documentation and reporting related to production performance and improvements.

Education :

Bachelor’s Degree in Manufacturing Engineering, Mechanical Engineering, Industrial Engineering, or a related field.

Job Requirements :

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Manufacturing, Transport & Logistics More than 10,000 employees

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO / TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site : MLP MICRO I.C. PDIP (300 / 600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site : MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150 / 300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4 / 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test / Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (

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Perks and benefits Medical Education support Dental Parking Medical for immediate family members, car subsidy

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