Engineer Development

Responsible for setting up the Die Attach Process Recipe and process parameters.

Job Description

In your new role you will :

• Establish new Die Attach processes and recipes, conduct comprehensive window studies, Design of Experiments (DOEs), and define specification limits.
• Qualify processes to meet Critical to Quality Requirements, including CPK, perform full risk assessments, assess Units Per Hour (UPH), and engage in problem-solving.
• Develop new processes for emerging wafer technologies, next-generation products, and new materials or tooling.
• Ensure a smooth transition of processes for new device or product induction into High Volume Manufacturing (HVM).
• Documentation includes Work Instructions (WI), Standard Operating Procedures (SOP), Out-of-Control Action Plans (OCAP), Process Design Reviews (PDR), Failure Modes and Effects Analysis (FMEA), Control Plans, and 8D reports.

Your Profile

You are best equipped for this task if you have :

We are a global leader in semiconductor solutions in power systems and IoT, enabling game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. We drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals.

We embrace diversity and inclusion and welcome everyone for who they are. We offer a working environment characterized by trust, openness, respect, and tolerance and are committed to giving all applicants and employees equal opportunities.

#J-18808-Ljbffr