ENGR SR, PACKAGE DEVELOPMENT_TL (NPI)

onsemi is currently seeking a skilled and driven NPI Engineer – Soldering Process, Diebond and Wirebond

to lead the introduction and optimization of soldering processes for new product lines in a high-tech manufacturing environment. This role is essential in ensuring robust process integration, high-yield production, and seamless transition from development to manufacturing. The position reports to the Director, New Product Engineering. Responsibilities

Leads the development and implementation of soldering, diebond and wirebond processes for new product introductions (NPI). Collaborate with R&D, Process Engineering, and Manufacturing teams to ensure soldering diebond and wirebond processes meet design and reliability requirements. Defines process parameters, control plans, and qualification strategies for soldering diebond and wirebond operations. Conducts DFM (Design for Manufacturability) reviews with a focus on solder / wire joint integrity and thermal profiles. Develops and executes process validation plans including DOE, capability studies, and reliability testing. Supports prototype builds and pilot runs, analyzing soldering diebond and wirebond performance and implementing improvements. Creates and maintains detailed documentation including work instructions, process flows, and FMEAs. Evaluates and qualifies soldering diebond and wirebond equipment, materials (e.g., solder paste, flux), and tooling. Implement automation and inspection technologies such as AOI, X-ray, and solder paste inspection (SPI). Drives root cause analysis and corrective actions for soldering-related defects and yield issues. Works closely with suppliers to evaluate and qualify soldering diebond and wirebond materials and equipment. Ensures compliance with IPC standards (e.g., IPC-A-610, J-STD-001) and customer requirements. Tracks and reports NPI metrics including yield, defect rates, and process stability. Qualifications

The ideal candidate should demonstrate proficiency in : In-depth knowledge of soldering diebond and wirebond processes including reflow, wave, selective, and hand soldering. Experience with SMT assembly, solder paste printing, and thermal profiling. Familiarity with IPC standards and solder joint inspection criteria. Strong understanding of materials behavior under thermal and mechanical stress. Proficiency in statistical tools (SPC, DOE, FMEA) and data analysis. Excellent project management and cross-functional collaboration skills. Strong problem-solving and troubleshooting capabilities. Effective communication and documentation skills. Ability to manage multiple projects in a fast-paced environment. Requirements : Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electronics Engineering, or related field. 3+ years of experience in NPI or process engineering with a focus on soldering in electronics or semiconductor manufacturing. Hands-on experience with soldering equipment, reflow ovens, and inspection systems. Proficiency in MS Office tools; advanced Excel skills required. Experience with MES systems; Wonderware experience is a plus. Familiarity with ISO and quality management systems. About Us

onsemi

(Nasdaq : ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. More details about our company benefits can be found here : We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. Job Info

Job Identification Job Category Engineering Posting Date 09 / 10 / 2025, 01 : 49 AM Degree Level Bachelors Job Schedule Full time

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