Senior Engineer (Die Attach & Clip Attach)

Senior Engineer (Die Attach & Clip Attach) page is loaded## Senior Engineer (Die Attach & Clip Attach)locations : Serembanposted on : 今天发布job requisition id : R- ###

• About the Role
• As a
• Senior Engineer
• specializing in
• Die Attach and Clip Attach (DACA)
• processes, you will lead the development, optimization, and qualification of advanced semiconductor packaging technologies. You will collaborate closely with cross-functional teams to ensure manufacturability, reliability, and cost-effectiveness of new package designs from concept through high-volume production.### ###
• What You Will Do
• Process Development & Optimization
• Develop and sustain
• die attach and clip attach processes
• for new and existing semiconductor packages.
• Lead
• material and equipment evaluations
• to enhance process robustness, yield, and throughput.
• Drive
• continuous improvement
• in process capability, equipment utilization, and cost efficiency.
• Perform
• root cause analysis
• and implement corrective and preventive actions (CAPA) for yield or quality issues.
• Define and maintain
• process documentation
• , including control plans, specifications, and FMEAs.
• New Product Introduction (NPI)
• Collaborate with
• R&D, Product Design, and NPI teams
• to translate new package designs into manufacturable solutions.
• Support
• prototype builds
• process characterization
• , and
• qualification runs
• Establish process parameters and guidelines to ensure smooth transition to
• high-volume manufacturing (HVM)
• Cross-Functional Collaboration
• Partner with
• Equipment and Manufacturing Engineering
• teams to define and validate tooling, machine capability, and process windows.
• Work with
• Quality and Reliability
• teams to ensure compliance with internal and customer standards.
• Provide
• technical guidance and training
• to process engineers and technicians.
• Continuous Improvement
• Lead
• Manufacturing Value Add (MVA)
• cost reduction
• , and
• yield improvement
• projects.
• Evaluate new technologies and methodologies to enhance process performance and scalability.### ###
• What You Will Need
• Bachelor’s or Master’s Degree
• in Mechanical, Electrical, Electronics, Materials, or related Engineering field.
• Minimum
• 5 years of experience
• in semiconductor assembly, specifically in
• Die Attach / Clip Attach
• processes.
• Strong hands-on experience with
• epoxy, sinter, eutectic
• , and
• solder attach
• technologies.
• Knowledge of
• process control
• DOE
• FMEA
• , and
• statistical analysis (SPC, Minitab)
• Experience in
• equipment and material qualification
• and
• NPI transfer to mass production
• Excellent analytical, troubleshooting, and communication skills.
• Able to work independently in a fast-paced, cross-functional environment.
• Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.
• D&I Statement
• As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

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