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Process Development Staff Engineer (Die Attach / Wire Bond)

Process Development Staff Engineer (Die Attach / Wire Bond)

Ams OsramBayan Lepas, Penang, Malaysia
30+ days ago
Job description

Responsibilities

  • Develop Die Attach & Wire Bond process for mass production to handshake with operation team per project targeted timeline.
  • Support and contribute in Die Attach & Wire Bond technology building block / roadmap.
  • Support new product pre-series and ramp-up.
  • Support post Q5 product quality, yield and FAR topics.

Qualifications

  • Bachelor or Master degree in engineering or relevant field.
  • 5 - 10 years in semiconductor Die Attach & Wire Bond process engineering field.
  • 5 - 10 years in Die Attach & Wire Bond process development.
  • DA & WB process egnineering knowledge & hands on skillset in semiconductors or LED manufacturing processes.
  • Knowledge in process development step and statistic.

    • Contact

    Nurul Ain Rosli will be happy to answer any questions you may have.

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