Process Development Staff Engineer (Die Attach / Wire Bond)
Ams OsramBayan Lepas, Penang, Malaysia30+ hari lalu
Penerangan pekerjaanBachelor or Master degree in engineering or relevant field. 5 - 10 years in semiconductor Die Attach & Wire Bond process engineering field. 5 - 10 years in Die Attach & Wire Bond process development. DA & WB process egnineering knowledge & hands on skillset in semiconductors or LED manufacturing processes. Knowledge in process development step and statistic.
Responsibilities
- Develop Die Attach & Wire Bond process for mass production to handshake with operation team per project targeted timeline.
- Support and contribute in Die Attach & Wire Bond technology building block / roadmap.
- Support new product pre-series and ramp-up.
- Support post Q5 product quality, yield and FAR topics.
Qualifications
Contact
Nurul Ain Rosli will be happy to answer any questions you may have.
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Staff Engineer • Bayan Lepas, Penang, Malaysia
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