engr sr, package development_tl

onsemi is currently seeking a skilled and driven NPI Engineer – Soldering Process, Diebond and Wirebond to lead the introduction and optimization of soldering processes for new product lines in a high-tech manufacturing environment. This role is essential in ensuring robust process integration, high-yield production, and seamless transition from development to manufacturing. The position reports to the Director, New Product Engineering.

onsemi(Nasdaq : ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here :

• Leads the development and implementation of soldering, diebond and wirebond processes for new product introductions (NPI).
• Collaborate with R&D, Process Engineering, and Manufacturing teams to ensure soldering diebond and wirebond processes meet design and reliability requirements.
• Defines process parameters, control plans, and qualification strategies for soldering diebond and wirebondoperations.
• Conducts DFM (Design for Manufacturability) reviews with a focus on solder / wire joint integrity and thermal profiles.
• Develops and executes process validation plans including DOE, capability studies, and reliability testing.
• Supports prototype builds and pilot runs, analyzing soldering diebond and wirebond performance and implementing improvements.
• Creates and maintains detailed documentation including work instructions, process flows, and FMEAs.
• Evaluates and qualifies soldering diebond and wirebond equipment, materials (e.g., solder paste, flux), and tooling.
• Implement automation and inspection technologies such as AOI, X-ray, and solder paste inspection (SPI).
• Drives root cause analysis and corrective actions for soldering-related defects and yield issues.
• Works closely with suppliers to evaluate and qualify soldering diebond and wirebond materials and equipment.
• Ensures compliance with IPC standards (e.g., IPC-A-610, J-STD-001) and customer requirements.
• Tracks and reports NPI metrics including yield, defect rates, and process stability.

Competencies :

The ideal candidate should demonstrate proficiency in :

Requirements :