Principal Engineer Package Technology

Overview

In your new role you will :

• Execute PBC and TPC assessment within A-project development.
• Driver of Package Technology DFMEA for A-project.
• Owner of Risk Interaction assessment and mitigation work packages.
• Responsible for the integration of unit processes (BOM and Process) in package platform - Risk assessment, study interactions with other processes and process flow.
• Key working partner for FE in FE / BE for new FE technology, process interaction and integration topics.
• Support Pre development for new Chip technology / new package development within development platform.

Your Profile

You are best equipped for this task if you have :

WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.

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