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ENGR SR, PACKAGE DEVELOPMENT_TL (NPI)

ENGR SR, PACKAGE DEVELOPMENT_TL (NPI)

onsemiSeremban, Negeri Sembilan, Malaysia
1 hari lalu
Penerangan pekerjaan

onsemi is currently seeking a skilled and driven NPI Engineer – Soldering Process, Diebond and Wirebond to lead the introduction and optimization of soldering processes for new product lines in a high-tech manufacturing environment. This role is essential in ensuring robust process integration, high-yield production, and seamless transition from development to manufacturing. The position reports to the Director, New Product Engineering.

Responsibilities

  • Leads the development and implementation of soldering, diebond and wirebond processes for new product introductions (NPI).
  • Collaborate with R&D, Process Engineering, and Manufacturing teams to ensure soldering diebond and wirebond processes meet design and reliability requirements.
  • Defines process parameters, control plans, and qualification strategies for soldering diebond and wirebondoperations.
  • Conducts DFM (Design for Manufacturability) reviews with a focus on solder / wire joint integrity and thermal profiles.
  • Develops and executes process validation plans including DOE, capability studies, and reliability testing.
  • Supports prototype builds and pilot runs, analyzing soldering diebond and wirebond performance and implementing improvements.
  • Creates and maintains detailed documentation including work instructions, process flows, and FMEAs.
  • Evaluates and qualifies soldering diebond and wirebond equipment, materials (e.g., solder paste, flux), and tooling.
  • Implement automation and inspection technologies such as AOI, X-ray, and solder paste inspection (SPI).
  • Drives root cause analysis and corrective actions for soldering-related defects and yield issues.
  • Works closely with suppliers to evaluate and qualify soldering diebond and wirebond materials and equipment.
  • Ensures compliance with IPC standards (e.g., IPC-A-610, J-STD-001) and customer requirements.
  • Tracks and reports NPI metrics including yield, defect rates, and process stability.

Qualifications

The ideal candidate should demonstrate proficiency in :

  • In-depth knowledge of soldering diebond and wirebond processes including reflow, wave, selective, and hand soldering.
  • Experience with SMT assembly, solder paste printing, and thermal profiling.
  • Familiarity with IPC standards and solder joint inspection criteria.
  • Strong understanding of materials behavior under thermal and mechanical stress.
  • Proficiency in statistical tools (SPC, DOE, FMEA) and data analysis.
  • Excellent project management and cross-functional collaboration skills.
  • Strong problem-solving and troubleshooting capabilities.
  • Effective communication and documentation skills.
  • Ability to manage multiple projects in a fast-paced environment.
  • Requirements

    Requirements :

  • Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electronics Engineering, or related field.
  • 3+ years of experience in NPI or process engineering with a focus on soldering in electronics or semiconductor manufacturing.
  • Hands-on experience with soldering equipment, reflow ovens, and inspection systems.
  • Proficiency in MS Office tools; advanced Excel skills required.
  • Experience with MES systems; Wonderware experience is a plus.
  • Familiarity with ISO and quality management systems.
  • About Us

    onsemi (Nasdaq : ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

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