Senior Project Manager Package Development

Be responsible for package / process development projects in close collaboration with all Infineon Business Units and global subcon partners, ensuring robust technical maturity and seamless transition into serial production. Focus will be on PCB Embedding and Panel Level Packaging for next generation Power Modules.

Job Description

• Be responsible for package / process development projects in close collaboration with all Infineon Business Units and global subcon partners, ensuring robust technical maturity and seamless transition into serial production. Focus will be on PCB Embedding and Panel Level Packaging for next generation Power Modules.
• Lead package innovation Projects starting from package / technology definition towards high volume integration.
• Be responsible for enabling and releasing new Subcons, package / technology platforms, as well as subsequent derivatives.
• Be responsible for change management projects, handling major changes to package, process or subcon.
• Lead international and multidisciplinary Teams (Europe, US, Asia).
• Support package platform assessments between subcons, as well as second source introduction.
• Support Subcon / Technology roadmap alignment.

Your Profile

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As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game‑changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

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