Assembly Customer Facing Program Manager
We are looking for an experienced Assembly Customer Facing Program Manager to serve as the key liaison between our wafer sort operations and customers. This role is ideal for someone with strong technical expertise in semiconductor assembly and a passion for driving operational excellence while ensuring customer satisfaction.
Roles and Responsibilities
- Will be responsible to oversee and drive progress of wafer sort test operations and output
- Will be the single point contact to all wafer sort customer requests covering planning, technical requirements, operational updates including output, quality and issues
- Will be the coordinator of internal teams to support customer requests
Qualification
Assembly background with 5-10 years’ experience and possess expertise in WLCSP, FCBGA and QFN (flip chip / wire bond) assembly processesDeep understanding of assembly line setup, process flow, and yield improvement for these technologiesProven ability to troubleshoot complex manufacturing issues related to these packages, including defect analysis and root cause identificationStrong background in implementing corrective actions based on customer feedback and internal quality metricsProactive in continuous process improvement to meet customer expectations and contractual requirementsKnowledge of industry standards and best practices in semiconductor assemblyCan read / write / speak fluent English and Mandarin (for engaging with China and Taiwan companies)Good presentation and communication skills#J-18808-Ljbffr