Overview
Director, Product and Test Engineering at Infineon Technologies.
Responsibilities
- Strong background in semiconductor BE packaging manufacturing and / or fabrication, specifically in Power Devices, with a minimum of 15 years of experience and at least 5 years of management experience.
- Requires exceptional technical expertise, strong leadership skills, and the ability to drive strategic initiatives.
- Responsible for leading cross-functional teams to develop and implement strategies for yield, cost, quality, and test improvements for Power Modules and Power Chip Embedded (CE) IC products at OSAT subcons in Malaysia, Thailand, Vietnam, China and other countries.
- Supporting introduction of new products, processes, and test methodologies, as well as collaborating with internal stakeholders in USA and Europe to ensure alignment with business objectives.
Your Qualifications
Bachelor of Science in Electrical Engineering or other engineering fields, such as Mechanical Engineering, Computer Engineering, or Materials Science.Master of Science (MS) degree in Electrical Engineering or other engineering fields is highly preferred.Minimum 15 years of experience in semiconductor fabrication and / or backend packaging, specifically in Power Devices.At least 5 years of management experience, with a proven track record of leading high-performing teamsStrong technical skills in semiconductor fabrication, backend packaging, and test engineering, with a deep understanding of Power Devices and Power IC products.Excellent leadership and communication skills, with the ability to motivate and inspire teams to achieve exceptional results.Strong analytical and problem-solving skills, with experience in data-driven decision-makingAbility to work in a fast-paced environment, with multiple priorities and deadlines.Infineon embraces diversity and inclusion and provides equal opportunities for all applicants and employees.
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