Recruitment Advisor Team Lead at Reeracoen | Hunting for Talents
Our client is a cutting-edge semiconductor solutions provider specializing in advanced SoC, chiplet, and multi-die technologies. With a focus on high-performance, low-power, and scalable designs, they are driving next-generation innovations that power data centers, AI, automotive, and consumer applications worldwide.
They are seeking a highly skilled and visionary IP Engineering Director to lead the development and delivery of reusable semiconductor IP. This role is ideal for a proven leader who can define technical roadmaps, drive execution, and build world-class teams while collaborating across hardware and software domains to deliver silicon-proven solutions.
Key Responsibilities
Define and execute the IP engineering roadmap aligned with overall product strategy.
Build, lead, and mentor a world-class engineering team across design, verification, validation, and integration.Foster a culture of innovation, collaboration, and technical excellence.Drive continuous improvement in design methodology, automation, and productivity.2. IP Development & ExecutionLead architecture, micro-architecture, and RTL design of reusable IP (e.g., high-speed I / Os, memory interfaces, SerDes, interconnects, accelerators).
Oversee verification, validation, and sign-off for robust, silicon-proven IP.Collaborate with SoC, packaging, and system teams for seamless IP integration into chiplet and multi-die systems.Support post-silicon bring-up, debug, and deployment.3. Cross-Functional CollaborationPartner with software teams to ensure HW / SW co-design and full-stack enablement.
Engage with system architects and product teams to align IP functionality with market requirements.Collaborate with foundries, EDA vendors, and ecosystem partners to enhance design flows.4. Program Management & DeliveryOwn IP program planning, milestones, schedules, and risk management.
Ensure high-quality IP delivery on time to both internal teams and external customers.Promote IP scalability and reuse across multiple product lines.Required Experience
Bachelor’s or Master’s in Electrical Engineering, Computer Engineering, or related field (PhD a plus).At least 15 years in semiconductor design with 5 years in a senior leadership or director role.Proven track record of delivering silicon-proven IP in SoCs or ASICs.Strong background in digital design (RTL, synthesis, STA), mixed-signal design, or high-speed interfaces.Knowledge of verification methodologies, DFx, and post-silicon validation.Familiarity with advanced packaging (2.5D / 3D IC, chiplets, interposers) is a strong plus.Excellent leadership, communication, and customer-facing skills.Seniority level
DirectorEmployment type
Full-timeJob function
Engineering, Information Technology, and ManagementIndustries
Semiconductor Manufacturing, Computers and Electronics Manufacturing, and IT System Design Services#J-18808-Ljbffr
