We are hiring Engineers! | Talent Acquisition @ UST
Role Overview We are seeking a highly skilled
Package Design Engineer
with
5–8 years of experience
in advanced IC packaging. The ideal candidate will have strong expertise in
Flip Chip
and
multi-layer substrate (8+ layers) design , with a solid understanding of substrate manufacturing and assembly rules. The role requires close collaboration with cross-functional teams and vendors to deliver high-performance, reliable, and manufacturable package solutions. Key Responsibilities Perform the design and development of
multi-layer package substrates (8+ layers)
for advanced semiconductor devices. Perform package layout, routing, and stack-up planning using
EDA tools (Mentor Graphics, Cadence Allegro, PLA) . Ensure designs comply with
substrate manufacturing rules
(trace width / spacing, via design, impedance requirements). Incorporate
assembly rules
(die placement, bump / ball pitch, solder joint reliability, warpage control) into package designs. Develop and validate
Flip Chip package designs , including bump assignment, redistribution layers (RDL), and underfill considerations. Collaborate with
Signal Integrity (SI), Power Integrity (PI), and thermal analysis teams
to ensure robust performance. Partner with
substrate vendors and OSATs
to verify design manufacturability, yield, and assembly feasibility. Provide
on-site vendor support
when required to resolve design and assembly issues. Skills & Qualifications Bachelor’s or Master’s degree in
Electrical Engineering, Electronics, Materials Science, or related field . 5–8 years of hands-on experience
in package design, with proven expertise in
multi-layer (8+) substrate design . Proficiency with
EDA tools : Mentor Graphics, Cadence Allegro, PLA. (Mentor Graphics Xpedition / Cadence Allegro Package Designer) Strong knowledge of
substrate manufacturing rules and assembly rules . Experience with
Flip Chip package design methodologies . Familiarity with
SI / PI / thermal considerations
in advanced packages. Strong
communication and collaboration skills
for cross-functional and vendor engagement. Flexibility to travel and provide
on-site vendor support
as needed. Seniority level : Mid-Senior level Employment type : Full-time Job function : IT Services and IT Consulting
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Design Engineer • Bayan Lepas, Malaysia