Research Engineer (Heterogeneous Integration), IME

Job Title : Heterogenous Integration Research Engineer

About Us : The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced wafer level packaging. Our research focuses on advanced packaging such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D / 3D packaging, and co-packaged optics. At IME, you’ll have access to state-of-the-art packaging equipment and be at the forefront of transformative research.

Position Overview : We are seeking a highly motivated Research Engineer to drive the development of advanced packaging processes. This role offers the opportunity to work on innovative technologies and contribute to high-impact projects that push the boundaries of semiconductor packaging.

Key Responsibilities :

• Innovative Process Development : Lead the design and development of advanced assembly processes for 2.5D / 3D packaging, Fan-Out Wafer-Level Packaging (FOWLP), and C2W hybrid bonding.
• Evaluation and Characterization : Coordinate and execute comprehensive evaluations of processes, equipment, and materials. Develop and implement new process qualifications and establish manufacturing guidelines.
• Project Collaboration : Work closely with project leaders to align on project requirements. Develop and enhance capabilities to meet evolving project needs.
• Intellectual Property and Reporting : Generate detailed engineering reports and contribute to the creation of new intellectual properties (IPs) and knowledge areas (KHs). Strengthen the IP portfolio related to heterogeneous integration.
• Customer and Market Engagement : Collaborate with internal and external stakeholders to understand future demands and develop the necessary capabilities to meet these needs.

Requirements :

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