Overview
Highly skilled and visionary IP Engineering Director, to lead the development and delivery of reusable semiconductor IP that powers advanced SoCs, chiplets, and multi-die solutions. This role requires deep expertise in semiconductor IP design, verification, and integration, combined with proven leadership in building and managing engineering teams. While the position is primarily focused on hardware IP development (digital, analog, or mixed-signal), software development experience—such as firmware, device drivers, or modeling frameworks—is a strong plus, enabling HW / SW co-design, system-level optimization, and accelerated customer adoption. The IP Engineering Director will define technical roadmaps, oversee execution, and collaborate with cross-functional teams to deliver silicon-proven IP solutions that meet aggressive power, performance, and area (PPA) targets.
Responsibilities
Define and execute the company’s IP engineering roadmap aligned with product strategy.
Lead architecture, micro-architecture, and RTL design of reusable IP (e.g., memory interfaces, high-speed I / Os, interconnects, SerDes, or accelerators).
Partner with software teams on firmware, drivers, and simulation frameworks to ensure full-stack enablement.
Own IP program planning, milestones, schedules, and risk management.
Own NoC project planning, execution, and delivery, ensuring schedule adherence and quality.
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Director Engineering • Bayan Lepas, Penang, Malaysia