Job Description
In your new role you will :
- Perform IC (complex functional) Failure Analysis (FA) on wafer and package level from electrical verification, fault isolation and physical root cause analysis.
- Prepare FA reports that can lead to root cause finding and corrective action to cross functional team.
- Participate, lead and present FA results in cross functional meetings, projects, yield improvement, urgent and important meetings.
- FA equipment / tool ownership.
- Interface with designers, test, product, process integration and unit process engineers to understand the analysis requirement.
- Identify development opportunity of new EFA techniques and improvise FA skills and techniques to enhance analysis quality, speed and cost.
- Responsible for achieving EFA KPIs.
Your Profile
Degree / Master / PhD in Electrical and Electronic Engineering.Complex Electrical Failure Verification and Localization, e.g. scan logic, Hi-Level Tester, SDL analysis.Familiar with Sample preparation, e.g. mechanical polishing, precision cleaving, wet / dry chemical, backside preparation, package preparation.Capable on Imaging, e.g. optical, SEM and FIB (incl. Voltage Contrast).Capable of CAD Navigation plus Cross Mapping Schematic, Software Diagnosis on Logic FA Circuit troubleshooting via micro probing (A-pad, FIB pad or AFP).Semiconductors are crucial to solve the energy challenges of our time and shape the digital transformation. This is why Infineon is committed to actively driving decarbonization & digitalization. As a global semiconductor leader in power systems & loT, we enable game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure loT. We make life easier, safer, and greener. Together with our customers and partners. For a better tomorrow.
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