Research Engineer (Heterogeneous Integration), IME

Job Title : Heterogenous Integration Research Engineer About Us :

The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced wafer level packaging. Our research focuses on advanced packaging such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D / 3D packaging, and co-packaged optics. At IME, you’ll have access to state-of-the-art packaging equipment and be at the forefront of transformative research. Position Overview :

We are seeking a highly motivated Research Engineer to drive the development of advanced packaging processes. This role offers the opportunity to work on innovative technologies and contribute to high-impact projects that push the boundaries of semiconductor packaging. Key Responsibilities : Innovative Process Development :

Lead the design and development of advanced assembly processes for 2.5D / 3D packaging, Fan-Out Wafer-Level Packaging (FOWLP), and C2W hybrid bonding. Evaluation and Characterization :

Coordinate and execute comprehensive evaluations of processes, equipment, and materials. Develop and implement new process qualifications and establish manufacturing guidelines. Project Collaboration :

Work closely with project leaders to align on project requirements. Develop and enhance capabilities to meet evolving project needs. Intellectual Property and Reporting :

Generate detailed engineering reports and contribute to the creation of new intellectual properties (IPs) and knowledge areas (KHs). Strengthen the IP portfolio related to heterogeneous integration. Customer and Market Engagement :

Collaborate with internal and external stakeholders to understand future demands and develop the necessary capabilities to meet these needs. Requirements : Educational Background :

Master's degree or bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering. Experience :

Experience in process development or packaging R&D, with a strong track record in advanced packaging technologies is added advantage.

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