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About Chipbond Technology Corporation
Chipbond Technology Corporation is in Manufacturing, Transport & Logistics with 101-1,000 employees. The company was founded in July 1997 as a downstream packaging and testing service provider in the semiconductor industry, headquarters in Taiwan, Hsinchu Science Park. We have expanded the operations to 6 locations with approximately 5,200 people. We are one of the few companies in the country that possesses a competitive advantage in the entire process of manufacturing, packaging and testing of driver ICs. Additionally, we are the world\'s largest packaging and testing facility for display driver ICs and hold a prominent position among the top ten semiconductor packaging and testing companies globally. We are expanding our footprint to Penang, Malaysia. Let\'s join us as Pioneer Team!
Chipbond Technology was founded in July 1997, as a downstream packaging and testing service provider in the semiconductor industry, headquarters in Taiwan, Hsinchu Science Park. We have expanded the operations to 6 locations with approximately 5,200 people. We are one of the few companies in the country that possesses a competitive advantage in the entire process of manufacturing, packaging and testing of driver ICs. Additionally, we are the world\'s largest packaging and testing facility for display driver ICs and hold a prominent position among the top ten semiconductor packaging and testing companies globally. We are expanding our footprint to Penang, Malaysia. Let\'s join us as Pioneer Team!
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Warehouse Officer • Seberang Perai, Penang, Malaysia