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We are seeking experienced Equipment Engineers and SMT Senior Engineers to join our dynamic engineering team. These roles are critical in driving process improvement, maintaining equipment performance, and ensuring high-quality production in a fast-paced semiconductor manufacturing environment.
Main Responsibilities :
Drive line improvement initiatives to sustain and enhance line performance.
Oversee and troubleshoot sudden equipment breakdowns.
Lead OEE (Overall Equipment Effectiveness) improvement and cost-saving projects.
Handle customer and quality system audits.
Collaborate with suppliers for material and process enhancement.
Requirements :
Degree or Diploma in Electronics, Mechanical, or Mechatronics Engineering .
Minimum 3 years of working experience in the semiconductor or related field .
Hands-on experience in EOL (End of Line) equipment / processes is preferred.
Strong machine troubleshooting skills and solid technical knowledge .
Excellent problem-solving, analytical, and communication skills.
Job Responsibilities :
Develop and implement new SMT (Surface Mount Technology) processes to meet production requirements.
Optimize existing SMT processes to improve efficiency, reduce costs, and enhance product quality.
Conduct process capability studies and SPC (Statistical Process Control) analysis.
Lead process improvement initiatives focusing on yield and quality enhancement.
Troubleshoot and maintain SMT line equipment (screen printing, solder paste, reflow, and component attachment).
Prepare and manage process documentation (WI, Control Plan, FMEA).
Perform process simulations, risk assessments, and audits.
Drive root cause analysis and implement corrective actions for SMT-related issues.
Collaborate cross-functionally with design, production, and quality teams.
Requirements :
Bachelor’s Degree in Engineering or related discipline .
Minimum 3 years of experience in SMT processes or equivalent manufacturing environment.
Strong technical knowledge in SMT equipment and process control.
Familiar with Six Sigma methodologies (DMAIC) and FMEA .
Six Sigma certification is an advantage.
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Manufacturing, Transport & Logistics More than 10,000 employees
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia\'s most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO / TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem\'s existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site : MLP MICRO I.C. PDIP (300 / 600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site : MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150 / 300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4 / 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test / Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem\'s policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (
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Perks and benefits Medical Education support Dental Parking Medical for immediate family members, car subsidy
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Equipment Engineer • Ipoh, Perak, Malaysia