Senior Engineer, Wire Bond Process Dev Engineering

Senior Engineer, Wire Bond Process Dev Engineering

Define the process window and recipe baseline by using JMP DOE approach.

Good in problem solving and work on the Root Cause Analysis / Finding using 5 whys, DMAIC, 8D approach / methodology.

Work closely with cross‑site package development teams to understand package design rules and requirements.

Ensure smooth transition from development to new product qualification phase.

Work closely with manufacturing process, equipment teams, and cross‑site process development teams.

Document SOP, WI, FMEA, OCAP, and control plan for related processes.

Ensure effective handshake / pass‑over of process for new device / product introduction to the production line and develop new process technology capabilities.

Responsible for new material / component first‑article inspection and final buy‑off.

Continuous improvement on direct / indirect material / UPH cost down and yield enhancement program.

Ensure robustness of process control to meet yield and throughput expectations.

Report any non‑conformance / customer complaint issue and develop / follow up the improvement actions.

Qualifications

REQUIRED : Minimum Bachelor or higher engineering degree (Material / Mechanical / Mechatronics / E&E, Physics & etc).

Preferred

Hands‑on production line focus personnel.

Good project planning, strong sense of quality and urgency.

Team player with good communication and interpersonal skills.

Skills

• JMP
• MiniTab
• 8D
• Six Sigma
• SPC

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