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Equipment Engineering
CHIPBOND TECHNOLOGY MALAYSIA SDN. BHD.Butterworth, Pulau Pinang, Malaysia13 jam yang lalu
Penerangan pekerjaanPhoto Equipment PM Engineer (Bumping) Photo Equipment Engineer (Bumping) Packaging Equipment Engineer Test Equipment PM Engineer Probe Card Engineer Prober Engineer The above positions require proficiency in Mandarin, English, and Malay. At least 1 year of relevant equipment-related work experience.
Job Description
- Electroplating & Etching Engineer
Equipment development, troubleshooting, and root cause analysis.
Routine maintenance, inspections, and parts management.
Process optimization, documentation, and cost-down projects.
Equipment upgrades, anomaly handling, training, and reporting.
Preventive maintenance planning and calibration support.
Card inspection, maintenance, tracking, and vendor coordination.
Troubleshooting, efficiency improvement, and machine relocation.
Job Requirements
Mandarin proficiency is highly preferred, as the position involves frequent coordination and reporting to the Taiwan headquarters and Mandarin-speaking clients.
Buat amaran kerja untuk carian ini
Equipment Engineering • Butterworth, Pulau Pinang, Malaysia
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