Principal Engineer Package Technology

Overview

Drive Technology Integration activities to ensure the package fulfil the requirements in the aspect of Process Interactions.

Responsibilities

• Execute PBC and TPC assessment within A-project development.
• Driver of Package Technology DFMEA for A-project.
• Owner of Risk Interaction assessment and mitigation work packages.
• Responsible for the integration of unit processes (BOM and Process) in package platform - Risk assessment, study interactions with other processes and process flow.
• Key working partner for FE in FE / BE for new FE technology, process interaction and integration topics.
• Support Pre development for new Chip technology / new package development within development platform.

Your Profile

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

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