BGA Process Engineer (Preferable Chinese Literate)

Overview

To be responsible and focus on the design, development, and optimization of Ball Grid Array components used in electronic devices, particularly in high-speed and high-density applications. Responsibilities include defining product requirements, optimizing BGA pinouts, and ensuring signal and power integrity, often collaborating with various teams to achieve optimal performance and manufacturability.

Responsibilities

• Defining Product Requirements : Working with system architects and product teams to establish specifications for BGA components.
• Process Engineering- Develop and optimize BGA assembly processes (wire bond or flip chip, underfill, ball attach, reflow, cleaning).
• Process Engineering- Ensure robust BGA solder ball formation and reflow profiles and troubleshoot BGA-related assembly issues like voids, open / short balls, delamination, etc.
• Process Engineering- Lead process excursions and implement corrective / preventive actions
• Yield Improvement & Failure Analysis- Perform root cause analysis on assembly / packaging failures (e.g., solder cracks, head-in-pillow). Lead FA discussion with FA engineer for FA activities like X-ray, CSAM, SAT, Cross-sectioning, and SEM / EDX.
• Yield Improvement & Failure Analysis- working with customer to establish the rework process for certain defect.
• Manufacturing & Sustaining Support- Establish manufacturing process controls (SOPs, FMEAs, SPC), Monitor and maintain process KPIs (yield, defect rate, cycle time).
• Manufacturing & Sustaining Support- Lead process excursions and implement corrective / preventive actions
• Cross-functional Collaboration- Work closely with vendors, quality teams and Interface with customer on BGA packaging inquiries or issues
• Cross-functional Collaboration- Support new product introduction (NPI) and design for manufacturability (DFM).
• Knowledge of ISO 9001, ISO 14001, ISO 13485, IATF 16949 standards is a plus

Qualifications

Skills

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