Senior Equipment Engineer (Molding)

Senior Equipment Engineer (Molding) page is loaded## Senior Equipment Engineer (Molding)locations : Serembanposted on : 今天发布job requisition id : R- ###

• About the Role
• The Molding Equipment Engineer is responsible for leading the maintenance, optimization, and continuous improvement of molding equipment performance across diverse semiconductor package types. This role plays a key part in ensuring equipment reliability, driving productivity, and supporting high-volume manufacturing through effective troubleshooting, process validation, and collaboration with cross-functional teams.###
• What You Will Do
• Lead the maintenance and performance improvement of molding equipment across various package types.
• Monitor equipment downtime (DT) and implement mitigation plans through MTBF / MTBA analysis.
• Evaluate scheduled DT activities to ensure verification and buy-off meet equipment specifications and performance targets.
• Partner with process engineering to validate new product designs during development and qualification for high-volume manufacturing (HVM).
• Collaborate with cross-functional teams to maintain and update technical documentation such as control plans, process specifications, SOPs, technical reports, and FMEAs.
• Plan and manage technician headcount coverage for 24 / 7 operations, ensuring effective task delegation and clear communication.
• Mentor and coach technicians to strengthen engineering competencies and drive continuous performance improvement.
• Work closely with R&D, NPI, product design, and reliability teams to align molding equipment capabilities with package architecture and process requirements.
• Diagnose and resolve molding-related equipment and process defects.
• Facilitate seamless transfer and ramp-up of molding technology, process, and equipment into HVM.
• Contribute to the development of process technology roadmaps for advanced packaging, thin form factors, and emerging device architectures.
• Drive improvement projects related to MVA, yield enhancement, and UPH optimization.
• Manage spare parts inventory and coordinate procurement activities to minimize downtime.
• Liaise with suppliers and vendors for jig and fixture orders, ensuring on-time delivery of parts and equipment.
• Maintain strong compliance with EHS standards and thrive in a fast-paced manufacturing environment.###
• What You Will Need
• Bachelor’s degree in an engineering discipline.
• Minimum
• 5 years of experience
• in the semiconductor industry, with at least
• 3 years specializing in EMC molding
• Hands-on experience in
• compression or transfer molding processes
• , including thin flat mold, exposed pad, and multi-die molding.
• Proficient in
• statistical analysis tools
• such as JMP and Minitab, with strong technical documentation skills.
• Solid understanding of
• mold compound properties
• , material flow dynamics, curing behavior, and interactions with other assembly materials (an added advantage).
• Strong analytical, problem-solving, and leadership skills.
• Ability to work effectively in a
• dynamic, high-volume manufacturing environment
• Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.
• D&I Statement
• As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

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