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Industrial Trainee - Advanced Package Design and Signal Integrity

Industrial Trainee - Advanced Package Design and Signal Integrity

Infineon Technologies AGSimpang Ampat, Penang, Malaysia
2 hari lalu
Penerangan pekerjaan

Job Description

In your new role you will :

  • Implementation of Academic knowledge such as circuit theory towards actual product Package Development process.
  • Implant foundation of Signal and Power Integrity concept and its contribution towards IFX device performance.
  • Build good practical sense of physical layout geometry of interconnects with respect to its electrical properties from time and frequency domain perspective.
  • Study package electrical parasitic effect and its trend from actual physical design through RLC database compilation and analytical exercise.
  • RLC database serving as referencing and AI-RLC development purposes.
  • Hands on experience using industry standard design and simulation tools, observe and analyze signal waveforms behavior and characteristics.
  • Leverage learning of Python / C-programming skill from school and help in design / sim automation development.
  • Understanding design attributes of various package types (lead frame, substrate, wire bond / FC / WL) through design files database compilation(currently scattering around local drive / share net)
  • Building a centralized substrate / lead frame attribute data base consolidates scattered design information, enabling quick reference for new design kick-offs, benchmarking, and cost comparisons. It also improves knowledge retention, cross-team collaboration, and error reduction while supporting supplier capability tracking and future scalability.

Your Profile

You are best equipped for this task if you have :

  • Bachelor Degree in Electrical, Electronics, Mechatronics, Optoelectronics, Power, Computer, Telecommunication, System, Software, Physic, Material, Mathematics, or whichever relevant
  • Graduation by immediate period with on-job availability is a plus
  • Candidates from course background of Basic Electronics, Electromagnetic Theory, RF, Microwave, Analog, Power System, or any relevant are encouraged
  • Internship with practical hands-on experience of basic electrical modelling / simulation, or basic lab measurement experiences is a plus
  • Minimum CGPA : 3.0
  • WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

    Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities.

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    Advanced Package And • Simpang Ampat, Penang, Malaysia

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