Wirebond Engineer

Job Summary :

As a Wirebond Engineer at onsemi, you will be responsible for developing, optimizing, and sustaining wire bonding processes used in semiconductor packaging. You will work closely with cross-functional teams to ensure high-quality, cost-effective, and reliable interconnect solutions for advanced IC packages.

Key Responsibilities :

• Develop and optimize wire bonding processes (Au, Cu, Al) for various package types.
• Evaluate and qualify new wirebond materials, equipment, and technologies.
• Troubleshoot wirebond-related issues including bond integrity, pad cratering, and wire sweep.
• Conduct failure analysis and implement corrective actions to improve yield and reliability.
• Collaborate with design, process, and quality teams to ensure robust product development.
• Support production ramp-up and continuous improvement initiatives.
• Maintain documentation for process specifications, control plans, and engineering reports.
• Ensure compliance with industry standards and internal quality requirements.

Qualifications :

Preferred Skills :

Additional Information :

Wage & Salary

Working Hours

Monday to Friday : 8.00am – 5.00pm (Please observe your location working hours)

Periodically rotating shift structure.

Shift working schedule :        Day Shift    : 6.00am – 6.00pm

Night Shift : 6.00pm – 6.00am

Overtime Rate :

Overtime hours is any number of hours more than the normal hours of work completed per day.

Annual Leave :

Others :

To report a concern, visit or contact onsemi Helpline at anonymously.