Wire Bond Process Engineer

Overview

Develop, optimize and implement robust wire bonding processes for new semiconductor product. This includes developing process parameters, troubleshooting defects, ensuring quality and yield, managing documentation and collaborating with equipment engineers to ensure successful product introductions. Responsibilities

Determine the optimum process condition through comprehensive evaluation to supply best quality. Perform process characterization through Design of Experiments (DOE) to ensure robustness and reliability. Identify and resolve wire bonding issues, perform root cause analysis on defects, and implement continuous improvement (PDCA) for quality key indicators. Create, update and maintain manufacturing documentation, such as wire bonding recipes, technical reports and process specifications. Qualifications

Bachelor’s degree in engineering – Mechanical / Electrical / Electronics / Mechatronics / Semiconductor Technology or equivalent. Experience : 2+ years in semiconductor industry, especially with new product introduction (preferred). Experience operating wire bonder machines (K&S and Shinkawa) and creating recipes (preferred). About Renesas and Workplace Information

Renesas is an embedded semiconductor solution provider driven by its Purpose “To Make Our Lives Easier.” We are committed to diversity and a discrimination-free work environment. We have adopted a hybrid model with in-office days (Tue–Thu) to foster collaboration and continuous learning.

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