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Failure Analysis Engineer (Staff Level)

Failure Analysis Engineer (Staff Level)

BusinesslistKuala Lumpur, Kuala Lumpur, Malaysia
3 hari lalu
Penerangan pekerjaan

Failure Analysis Engineer (Staff Level) Posting Date : 24 Oct 2025 | Close Date : 22 Jan 2026

Client Background : computer technology company

Tenure : Permanent

Location : Batu Kawan, Penang

Headcount : 1

Key Responsibilities

  • Conduct failure analysis (FA) on assembly products to assess solderability integrity, both on fresh assemblies and after environmental stress testing.
  • Define and optimize FA flows and methodologies for different case types to ensure accuracy and efficiency.
  • Prepare detailed FA reports , summarize findings, and assist engineering teams in identifying and resolving defect root causes.
  • Develop and validate new FA processes, methods, and capabilities to support new product introductions and emerging technologies.
  • Plan and execute projects effectively, ensuring timely and cost-efficient delivery of results.
  • Maintain the Failure Analysis Laboratory in compliance with internal quality systems and standards.

Qualifications

Required :

  • Bachelor’s or Master’s Degree in Electrical & Electronic Engineering or Materials Engineering .
  • Minimum 5 years of hands‑on experience in Failure Analysis (FA) within the semiconductor, electronics, or related industry.
  • Familiarity with IC and passive component structures and defects .
  • Understanding of semiconductor and SMT assembly processes and technologies .
  • Knowledge of memory product structure and test methodologies .
  • Proven experience preparing technical FA reports and presenting analytical findings.
  • Strong communication, teamwork, and problem‑solving abilities.
  • Fluent in English (speaking, reading, and technical writing).
  • Prior FA experience in IC or memory device analysis is a strong advantage.
  • Technical Skills

  • Proficient in the use of FA instruments and techniques , including :
  • 3D X-Ray, Ion Milling, CSAM, SEM / EDX, EBSD, FIB, TEM, TDR, Optical Microscopy, Chemical Decapsulation, and Curve Tracer Analysis.

  • Expertise in solder joint and solder microstructure characterization .
  • Strong analytical, troubleshooting, and technical documentation skills.
  • Ability to apply advanced engineering principles to solve complex technical problems independently.
  • #J-18808-Ljbffr

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