Open for Expatriates (Any Nationalities) as a working permit will be provided.
- Accommodation Provided
- Meal Provided
Core Job Responsibilities
Drive the development, implementation, and continuous improvement of solder ball packaging technologies (e.g., wafer bumping, flip chip packaging).Establish equipment inspection and process control standards; optimize soldering parameters to enhance yield and production efficiency.Identify and analyze soldering defects (e.g., bridging, cold solder, balling issues); recommend and implement effective process improvement solutions.Qualifications
Bachelor's degree or above in Engineering, Materials, Electronics, or related fields.Hands-on experience in semiconductor packaging, assembly, or related manufacturing processes.Understanding of key processes such as soldering, plating, printing, or mounting.Familiarity with packaging materials (e.g., PCBs, solder paste, resins) and related equipment is an advantage.Experience in solder ball or advanced packaging technologies will be considered a plus.Strong problem-solving mindset and willingness to learn new technologies.