Wafer Saw Engineer (S-Site, Jelapang)

Overview

Job Description : Wafer Saw Process Engineer (New Product Introduction)

Lead wafer saw process readiness for New Product Introduction (NPI), from initial evaluation through qualification and final production release.

Develop, optimize, and sustain wafer dicing recipes (e.g., blade selection, spindle speed, cut depth, coolant settings) to achieve target yield, quality, and cycle time.

Drive root cause analysis and implement corrective / preventive actions (CAPA) for yield loss, chipping, edge cracks, die shift, and other dicing-related issues.

Plan and execute Design of Experiments (DOE) and process characterization to validate new materials, wafer thicknesses, and advanced dicing methods (e.g., laser grooving, stealth dicing, hybrid approaches).

Support new equipment setup, tooling qualification, and buy-off to ensure compliance with product design, manufacturing standards, and customer requirements.

Collaborate with cross-functional stakeholders (Process Engineering, QA, Equipment, Planning, NPI Program Management) to align timelines, manage risks, and ensure smooth product ramp-up.

Review, approve, and maintain process documentation including Standard Operating Procedures (SOPs), Work Instructions (WI), and Control Plans for new product processes.

Monitor and analyze key process indicators (KPI) such as yield, Overall Equipment Effectiveness (OEE), Units Per Hour (UPH), and downtime, driving continuous improvement initiatives for cost, quality, and productivity.

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